Contact Information:
TAZMO Inc.
42840 Christy St.
Suite 103
Fremont, CA 94538
(510) 438-4890
eMail: Sales
eMail: Service
For our European partners, please visit www.teltec.com
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| Wafer Support System (WSS) - Bonder/Debonder |
These TWS 2000 and 3000 Series systems were designed for temporarily bonding of ultra thin wafer for advanced 3D packaging requirements. Unique UV hardening resion is used for the bonding of wafer and supporting material realizing excellent TTV, high accuracy alignment, normal temperature bonding and high throughput.
These system are currently used in the production of memory device, power device and various mass production lines fwhile achieving low CoO emission. |
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| TWS 2000 Series for 4-8" Wafers |
TWS 3000 Series for 300mm Wafers |
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| Features |
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High throughput |
Realised >24 WPH |
| High accuracy |
Achieving TTV (Total Thickness Variation) < 5µm |
Normal temperature bonding |
Almost no thermal impact to the wafer when bonding with supporting material by adopting UV hardening resin |
Low cost |
Repeated use of supporting material is possible thus used glass recycling tool is also line upped |
Dry process |
Bonding, de-bonding of supporting material is performed by all dry process with zero organic solvent used
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| Bonder |
Debonder |
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